Kingston Memorija PC-21300 HyperX Fury HX426C15FBK2/8 DDR4 2666Mhz 2x4GB - 8 GB

SPECIFICATIONS

*Power will vary depending on the SDRAM used.

HX426C15FBK2/8

8GB (4GB 512M x 64-Bit x 2 pcs.)

DDR4-2666 CL15 288-Pin DIMM

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kingston.com/hyperx

FEATURES

HyperX

HX426C15FBK2/8

is a kit of two 512M x 64-bit (4GB)

DDR4-2666 CL15 SDRAM (Synchronous DRAM) 1Rx8, memory

module, based on eight 512M x 8-bit FBGA components per

module.

Each module kit supports Intel® Extreme Memory

Profiles (Intel® XMP) 2.0.

Total kit capacity is 8GB. Each

module has been tested to run at DDR4-2666 at a low latency timing

of 15-17-17 at 1.2V.

Additional timing parameters are shown in

the Plug-N-Play (PnP) Timing Parameters section below.

The JEDEC standard electrical and mechanical specifications

are as follows:

CL(IDD)

Row Cycle Time (tRCmin)

Refresh to Active/Refresh

Command Time (tRFCmin)

Row Active Time (tRASmin)

Maximum Operating Power

UL Rating

Operating Temperature

Storage Temperature

15 cycles

45ns(min.)

260ns(min.)

26.25ns(min.)

TBD W*

94 V - 0

0

o

C to +85

o

C

-55

o

C to +100

o

C

JEDEC/XMP TIMING PARAMETERS

•

JEDEC/PnP: DDR4-2666 CL15-17-17 @1.2V

DDR4-2400 CL14-16-16 @1.2V

DDR4-2133 CL12-14-14 @1.2V

•

XMP Profile #1: DDR4-2666 CL15-17-17 @1.2V

• Power Supply: VDD = 1.2V Typical

• VDDQ = 1.2V Typical

• VPP - 2.5V Typical

• VDDSPD = 2.2V to 3.6V

• Nominal and dynamic on-die termination (ODT) for

data, strobe, and mask signals

• Low-power auto self refresh (LPASR)

• Data bus inversion (DBI) for data bus

• On-die VREFDQ generation and calibration

• Single-rank

• On-board I2 serial presence-detect (SPD) EEPROM

• 16 internal banks, 4 groups of 4 banks each

• Fixed burst chop (BC) of 4 and burst length (BL) of 8

via the mode register set (MRS)

• Selectable BC4 or BL8 on-the-fly (OTF)

• Fly-by topology

• Terminated control command and address bus

• Height 1.340” (34.04mm), w/heatsink